Take a Peek at What is Making CyberOptics Newsworthy and Noteworthy.
CyberOptics Semiconductor will feature its WaferSense® Auto Gapping System (AGS) along with their full line of WaferSense wireless metrology devices during Semicon West in booth 911 South, June 2010
New 450 mm WaferSense® Line Qualifies Nex-generation Tools; Includes Robot Teaching, Vibration and Leveling, March 2010
SEMICON China Features Demonstrations of Latest Wafer Processing Metrology Sensors, March 2010
Hermes-Epitek Singapore to Support Growth of WaferSense® in SE Asia, January 2010
CyberOptics Semiconductor Introduces Vibration-Monitoring Software to Japanese Market at SEMICON, Demonstrates Metrology Application’s Role in Metrics-Based Process Controls, December 2009
CyberOptics Semiconductor Lays Out Steps for a Vibration Diagnosis at AEC/APC Symposium in Asia, December 2009
CyberOptics Semiconductor Details Effects of Gap Measurement on Thin Film Production, November 2009
Vibration-Monitoring Software for Wafer-Processing Equipment to be Released at SEMICON Taiwan, September 2009.
New 450 mm WaferSense® Auto Leveling System (ALS) 2 Vertical Reduces Particle Contamination, Increases Yield
New Wireless 450 mm WaferSense® Auto Vibration System (AVS) Reduces Wafer Defects and Improves Die Yield
New WaferSense® Airborne Particle Sensor (APS) Demonstrated at SEMICON West
Fab Engineers Look to Validate, Analyze Real-Time Wafer Contamination in Process Equipment With Slated ’09 Release of New WaferSense® Airborne Particle Sensor (APS) From CyberOptics Semiconductor, Inc., February 2009
EDN Magazine Names the WaferSense® Auto Vibration System (AVS) From CyberOptics Semiconductor an EDN Innovation Award Finalist, February 2009
Fab Process Engineers Track, Validate Wafer-Transfer Coordinates for Handoff Robots and Establish Preventative Maintenance Schedules With New WaferSense® TeachReview™ Software From CyberOptics Semiconductor, Inc., January 2009
Engineers at SEMICON Japan Examine Effects of Equipment Vibration and Acceleration On Wafer Processing During Demonstrations by CyberOptics Semiconductor, Inc., December 2008
CyberOptics Semiconductor Names Ferris Chen Director of Asian Sales, November 2008
Process Engineers at ISMI Symposium Examine Role of Machine-Vision Technology in Robot Teaching for Endura Cluster Tool, October 2008
Japanese Fabs Examine Wafer-Processing Metrology at New Japanese-Language Website From CyberOptics Semiconductor, Inc. -- http://jp.cyberopticssemi.com/, September 2008
Wafer Processing Engineers at SEMICON Taiwan Consider Role of Machine-Vision Technology in Setting Wafer-Transfer Coordinates During Demo of WaferSense(tm) Auto Teaching System (ATS) From CyberOptics Semiconductor, Inc., August 2008
Fab Process Engineers Conduct Comparative Analysis of Equipment Acceleration,
Vibration With New VibeReview Software for Wireless Accelerometer From
CyberOptics Semiconductor, Inc. – WaferSense AVS, August 2008
Semiconductor Process Engineers Level Equipment With Enhanced Vertical Accuracy, Increased Range of Latest Wireless Inclinometer From CyberOptics Semiconductor, Inc. – WaferSense ALS2 Vertical, July 2008
Semiconductor International Names the WaferSense™ Auto Teaching System (ATS) from CyberOptics Semiconductor, Inc. a 2008 Editor's Choice for Best Product, July 2008
Novellus Systems Orders CyberOptics Semiconductor Metrology Tools To Maintain VECTOR Systems Used in 300 mm Fabs, April 2008
CyberOptics Semiconductor Sponsors ASMC 2008 Session
on New Methods for Optimizing Semiconductor Equipment Productivity, April 2008
CyberOptics Semiconductor introduces WaferSense Auto Vibration System,
designed to detect wafer-damaging equipment vibrations, November 2007
(ja-JP)
CyberOptics Semiconductor introduces WaferSense AGS200,
designed to significantly improve film deposition, sputter
and etch processing, September 2007
(zh-CN, ko-KR, ja-JP)
CyberOptics Semiconductor Introduces
WaferSense Auto Leveling System 2
Wireless sensor enables greater wafer processing uniformity and real-time feedback
to improve throughput and yield, July 2007
(zh-CN, ko-KR, ja-JP)
CyberOptics Semiconductor introduces WaferSense™ Auto Gapping
System that wirelessly measures gaps critical to semiconductor
processing, July 2007
(zh-CN, ko-KR, ja-JP)
CyberOptics Semiconductor Introduces WaferSense™ Automatic Teaching System that wirelessly teaches wafer transfer positions, January 2007
(zh-CN, zh-MO, ko-KR, ja-JP)
CyberOptics Semiconductor Awarded US Patent for Sensor Product, September 2006
CyberOptics Semiconductor Introduces WaferSense™ Auto Leveling System for Reticles (ALSR) and adds Anodized Option to wafer-like WaferSense ALS, May 2006
(zh-CN, ko-KR, ja-JP)
CyberOptics Semiconductor EX-Q and EX-QS wafer mapping sensors
provide reliable wafer detection in single wafer processing tool
(Japanese), May 2006
CyberOptics Semiconductor announces availability of EX-QS Wafer Mapping Sensor, September 2005
Rudolph Technologies selects EX-Q Wafer Mapping Sensor for Use on Metrology tools, March 2005
CyberOptics Semiconductor Introduces WaferSense™ Auto Leveling Sensor,
September 2004
Brooks Automation: Growing Profitability in Tough Times, December 2003
CyberOptics Semiconductor Announces the Release of the EX-Q Wafer Mapping Sensor, July 2003
CyberOptics Semiconductor Announces the Release of the EX Series of Wafer Mapping Sensors, May 2002
Imagenation Acquisition Press Release, October 2000
HAMA Sensors Acquisition Press Release, April 1999
