Press Releases

The WaferSense® Airborne Particle Sensor from CyberOptics Semiconductor was chosen as a finalist in The Best of the West 2011 Awards sponsored by Solid State Technology and SEMI at Semicon West in recognizing important product and technology developments in the microelectronics industries. Best of West finalists and award recipients were selected based on the submission’s financial impact on the industry, engineering or scientific achievement, or societal impact and benefits, according to Semicon West. A listing of award recipients can be found at: http://www.semiconwest.org/Participate/BestofWest/ August 24, 2011

Demonstrational videos explaining how WaferSense® wireless metrology devices seamlessly measure critical parameters in semiconductor fabrication processes are available on CyberOptics Semiconductor web site at http://www.cyberopticssemi.com/node/114. Products in the WaferSense family provide leveling, gapping teaching as well as detection of vibrations and airborne particles in semiconductor process equipment. These wireless measurement systems work together or alone to increase fab effectiveness, fine tune existing equipment and reduce overall cost of operations.  June 6, 2011

CyberOptics Semiconductors (www.CyberOpticsSemi.com) has published an application note on its web site explaining how its WaferSense® Auto Gapping System (AGS) has helped a 300 mm fab increase the availability of a plasma‐enhanced chemical vapor deposition (PECVD) tool. April 13, 2011

CyberOptics Semiconductors (www.CyberOpticsSemi.com) has published an application note on its web site discussing how its WaferSense® Vibration and Leveling Sensors helped a vertical diffusion group characterize various causes of wafer damage that occurred during high‐volume processing of wafers in a boat. February 25, 2011

After a year of beta testing and product analysis, CyberOptics Semiconductor, Inc. has released the WaferSense® Airborne Particle Sensor (APS) for wafer processing equipment to the semiconductor market. The only semiconductor sensor of its kind to identify particle sources in tool, the Airborne Particle Sensor moves through semiconductor process equipment and automation material handing systems to monitor airborne particles, reporting information in real-time to allow engineers to efficiently validate wafer contamination. February 9, 2011

CyberOptics Semiconductors introduces an updated release to its wafer vibration monitoring software, offering new capabilities for data analysis and third party data interfaces. January 5, 2011

CyberOptics Semiconductors demonstrates the latest release of its wafer vibration monitoring during Semicon Japan in booth number 5B-512. With vibration tied to semiconductor process equipment failure, low yields and cycle times, CyberOptics’ AVS 2.0 vibration monitoring software provides engineers the data needed to predict equipment failures to improve process yield and cycle times. December 1, 2010

CyberOptics Semiconductors will demonstrate its new Airborne Particle Sensor (APS) for wafer processing equipment during Semicon Japan in booth number 5B-512. December 1, 2010

CyberOptics Semiconductor will feature its WaferSense® Auto Gapping System (AGS) along with their full line of WaferSense wireless metrology devices during Semicon West in booth 911 South. June 11, 2010

SEMICON China to Feature Demonstrations of Latest Wafer-Like Processing Metrology Sensors From CyberOptics Semiconductor WaferSense® Sensors at Booth 3437 Hosted by Distribution Partner Scientech.  March 3, 2010